On the thermodynamic driving force for diffusion-induced grain boundary migration, discotinuous precipitation and liquid film migration in binary alloysFOURNELLE, R. A.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 1991, Vol 138, Num 1, pp 133-145, issn 0921-5093, 13 p.Article

Diffusion induced grain boundary migration (DIGM) and liquid film migration (LFM) in an Al-2.07wt %Cu alloyKUO, M; FOURNELLE, R. A.Acta metallurgica et materialia. 1991, Vol 39, Num 11, pp 2835-2845, issn 0956-7151Article

Effect of strontium modification on near-threshold fatigue crack growth in an Al-Si-Cu die cast alloySCHAEFER, M; FOURNELLE, R. A.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 1996, Vol 27, Num 5, pp 1293-1302, issn 1073-5623Article

Low temperature volume diffusion of zinc in aluminiumVARADARAJAN, S; FOURNELLE, R. A.Acta metallurgica et materialia. 1992, Vol 40, Num 8, pp 1847-1854, issn 0956-7151Article

Diffusion induced grain boundary migration and recrystallization in boron-doped Ni₃Al intermetallicsMA, C. Y; GUST, W; FOURNELLE, R. A et al.Scripta metallurgica et materialia. 1992, Vol 27, Num 9, pp 1235-1239, issn 0956-716XArticle

Morphology of surfaces generated by circular wire brushesSTANGO, R. J; FOURNELLE, R. A; CHADA, S et al.Journal of engineering for industry. 1995, Vol 117, Num 1, pp 9-15, issn 0022-0817Conference Paper

Differential scanning calorimetry measurement of the α/β interfacial enthalpy in an Al-29.5 at.% Zn alloy = Mesure par calorimétrie différentielle à balayage de l'enthalpie interfaciale dans un alliage Al-29,5% at.ZnSHAARBAF, M; EHLERT, T; FOURNELLE, R. A et al.Scripta metallurgica. 1987, Vol 21, Num 9, pp 1253-1256, issn 0036-9748Article

Morphology of metal surface generated by nylon/abrasive filament brushOVERHOLSER, R. W; STANGO, R. J; FOURNELLE, R. A et al.International journal of machine tools & manufacture. 2003, Vol 43, Num 2, pp 193-202, issn 0890-6955, 10 p.Article

A high temperature lattice parameter and dilatometer study of the defect structure of nonstoichiometric cerium dioxideHUANN-WU CHIANG; BLUMENTHAL, R. N; FOURNELLE, R. A et al.Solid state ionics. 1993, Vol 66, Num 1-2, pp 85-95, issn 0167-2738Article

Misorientation dependence of diffusion induced grain boundary migration (DIGM) in oriented Cu (Zn) bicrystalsGIAKUPIAN, B; SCHMELZLE, R; GUST, W et al.Journal de physique. Colloques. 1990, Vol 1, pp C1.489-C1.494, issn 0449-1947Conference Paper

Diffusion induced grain boundary migration in Ni(Zn) polycrystals = Migration des joints de grains induite par diffusion dans les polycristaux Ni(Zn)FOURNELLE, R. A; GIAKUPIAN, B; GUST, W et al.Journal de physique. Colloques. 1988, Num 10, pp C5.593-C5.598, issn 0449-1947Conference Paper

The morphology of discontinuous precipitation on the surface of Ni-In and Ni-Sn alloys = Morphologie de la précipitation discontinue sur la surface des alliages Ni-In et Ni-SnCHUANG, T. H; FOURNELLE, R. A; GUST, W et al.Scripta metallurgica. 1986, Vol 20, Num 1, pp 25-28, issn 0036-9748Article

Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion controlSCHAEFER, M; FOURNELLE, R. A; JIN LIANG et al.Journal of electronic materials. 1998, Vol 27, Num 11, pp 1167-1176, issn 0361-5235Conference Paper

Diffusion induced recrystallization at {011} surfaces of copper as the result of alloying with zincGIAKUPIAN, B; SCHMELZLE, R; MAYER, C et al.Scripta metallurgica et materialia. 1992, Vol 26, Num 6, pp 895-900, issn 0956-716XArticle

A numerical method for predicting intermetallic layer thickness developed during the formation of solder jointsSCHAEFER, M; LAUB, W; SABEE, J. M et al.Journal of electronic materials. 1996, Vol 25, Num 6, pp 992-1003, issn 0361-5235Article

High temperature digm in an Fe-5 at.% Al bicrystal during Zn diffusionRABKIN, E. I; STRAUMAL, B. B; SHVINDLERMAN, L. S et al.Scripta metallurgica et materialia. 1992, Vol 26, Num 6, pp 901-906, issn 0956-716XArticle

Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructureCHADA, S; FOURNELLE, R. A; LAUB, W et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1214-1221, issn 0361-5235Conference Paper

Diffusion induced grain boundary migration of symmetric and asymmetric <011> {011} tilt boundaries during the diffusion of Zn into CuSCHMELZLE, R; GIAKUPIAN, B; MUSCHIK, T et al.Acta metallurgica et materialia. 1992, Vol 40, Num 5, pp 997-1007, issn 0956-7151Article

Is coherency strain energy the driving force for diffusion induced grain boundary migration ?CHIEN-YUNG MA; LAUB, W; FOURNELLE, R. A et al.Zeitschrift für Metallkunde. 1992, Vol 83, Num 8, pp 633-637, issn 0044-3093Article